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This invention relates to a mechanical combination and method of producing a glass container, particularly a thermoplastic, collapsible and reclosable container.
In the prior art, a wide variety of both plastic and glass containers were produced, and their function varied, but many have been fabricated with a mechanical combination that facilitates the manufacture and efficient and economical use of the container in the subsequent conversion to the finished package product. By such prior art apparatus and method, the mechanical combination was usually accomplished in an operation that required the removal of a mechanical combination from the mold at the time the conversion operation was commenced. While the production of a container by such prior art method and apparatus was efficient, it was often difficult to accomplish the removal and securement of such container from the mold. Also, the process was inefficient and time consuming, and a relatively high cost due to the length of the extrusion and the mechanical combination removal phase of the process.1. Field of the Invention
The present invention relates to a method of manufacturing a semiconductor device. More particularly, the present invention relates to a method of manufacturing a semiconductor device using a wire bonding.
2. Description of the Related Art
In recent years, a conventional wafer level packaging process has been substituted by a wafer-level chip scale package (i.e. WLCSP). Thus, the WLCSP has become the mainstream of a semiconductor packaging technique.
As shown in FIGS. 1A and 1B, to package a semiconductor chip (1) on a support wafer (2) by using a wafer-level chip scale package (WLCSP) process, an array of array of lead balls (6) is formed on the support wafer (2), and then a molding compound (7) is filled in the cavity between the support wafer (2) and the semiconductor chip (1) so as to cover the chips (1) and the lead balls (6), thereby encapsulating the chip (1) and the lead balls (6) on the support wafer (2).
Because the semiconductor chip (1) and the lead balls (6) are covered by the molding compound (7) at the same time, when a predetermined pressure is applied, the molding compound (7) will be heated quickly to form a thin layer of the molding compound (7), thereby preventing the semiconductor chip (1) from being damaged. In addition, the molding compound (7) can be

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